693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Mantoux, Arnaud
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (9/9 displayed)
- 2024Silver nanowire networks coated with a few nanometer thick aluminum nitride films for ultra-transparent and robust heating applicationscitations
- 2020Improved critical temperature of superconducting plasma-enhanced atomic layer deposition of niobium nitride thin films by thermal annealingcitations
- 2019Superconducting properties of NbN thin films deposited by plasma enhanced atomic layer deposition using a metalorganic precursor
- 2018Aluminum nitride thin films deposited by hydrogen plasma enhanced and thermal atomic layer deposition
- 2017Chemical and electrochemical stability of copper in molten KF-2HF
- 2015Superconducting properties of NbN thin films deposited by plasma enhanced atomic layer deposition using a metalorganic precursor
- 2014Niobium nitride thin films deposited by high temperature chemical vapor depositioncitations
- 2009ESD and ALD Depositions of Ta 2 O 5 Thin Films Investigated as Barriers to Copper Diffusion for Advanced Metallizationcitations
- 2007Elaboration of Ta 2 O 5 Thin Films Using Electrostatic Spray Deposition for Microelectronic Applicationscitations
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