693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Bourrier, David
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (12/12 displayed)
- 2023Micron-to-Submicron Cu electroplating in view of Agile-X LSI Chips Fabrication using Open Facility
- 2023Full-SiC Single-Chip Buck and Boost MOSFET-JBS Converters for Ultimate Efficient Power Vertical Integration
- 20233D Integration of a µSieve for Particle Filtration Combined with real-time in-situ Analysis within Complex Media
- 2022Micro-perforated membrane for label-free cell capture and integrated electrical detection operating in whole blood
- 2021Porous RuOxNySz Electrodes for Microsupercapacitors and Microbatteries with Enhanced Areal Performancecitations
- 2020Embedded 3D-IPD Technology based on Conformal 3D-RDL: Application for Design and Fabrication of Compact, High-Performance Diplexer and Ultra-Wide Band Baluncitations
- 2017DNA grafting and arrangement on oxide surfaces for self-assembly of Al and CuO nanoparticlescitations
- 20133-D Multilayer Copper Interconnects for High-Performance Monolithic Devices and Passivescitations
- 2012Solenoidal Transformers for Magnetic Materials Integrationcitations
- 2012Low Cost 3D Multilevel Interconnect Integration for RF and Microwave Applications
- 2011Efficient Low Cost Process For Single Step Metal Forming of 3D Interconnected Above-IC Inductors
- 2009Development of a flexible microfluidic system integrating magnetic micro-actuators for trapping biological speciescitations
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