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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Proietti, Arnaud
Laboratoire Bourguignon des Matériaux et Procédés
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2024Austenitic-to-austenitic-ferritic stainless steel transformation via PVD powder surface functionalization and spark plasma sinteringcitations
- 2023Influence of bimodal copper grain size distribution on electrical resistivity and tensile strength of silver - copper composite wirescitations
- 2023Understanding the mechanisms of intergranular corrosion in 2024 Al alloy at the polycrystal scalecitations
- 2023Strain localization in Ti and Ti-alloys using three-dimensional topographic imaging
- 2023Protection of titanium alloys against high temperature oxidation during closed-die forging: Structural analysis of the boro-silicate glass coating/Ti-6Al-4V alloy interfacial region by correlative imagingcitations
- 2022Fire gilding investigation on early medieval copper-based jewellery by focused ion beam (FIB) on FEG-SEMcitations
- 2022Structural and Electrical Characterizations of BiSb Topological Insulator Layers Epitaxially Integrated on GaAscitations
- 2021Integration of the Rhombohedral BiSb(0001) Topological Insulator on a Cubic GaAs(001) Substratecitations
- 2021Creep of single-crystals of nickel-base γ-alloy at temperatures between 1150 °C and 1288 °Ccitations
- 2021Influence of alloying on the tensile strength and electrical resistivity of silver nanowire: copper composites macroscopic wirescitations
- 2020High Strength-High Conductivity Silver Nanowire-Copper Composite Wires by Spark Plasma Sintering and Wire-Drawing for Non-Destructive Pulsed Fieldscitations
- 2020Growth Kinetics and Characterization of Chromia Scales Formed on Ni–30Cr Alloy in Impure Argon at 700 °Ccitations
- 2019Solidification sequence and four-phase eutectic in AlSi6Cu4Fe2 alloycitations
- 2019Nanostructured 1% silver-copper composite wires with a high tensile strength and a high electrical conductivitycitations
Places of action
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