693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Morel, Hervé
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Topics
Publications (13/13 displayed)
- 2024Electrical characteristics and trap signatures for Schottky barrier diodes on 4H-SiC, GaN-on-GaN, AlGaN/GaN epitaxial substratescitations
- 2023Full-SiC Single-Chip Buck and Boost MOSFET-JBS Converters for Ultimate Efficient Power Vertical Integration
- 2020Demonstration of the Short-circuit Ruggedness of a 10 kV Silicon Carbide Bipolar Junction Transistorcitations
- 2017Protruding Ceramic Substrates for High Voltage Packaging Of Wide Bandgap Semiconductorscitations
- 2017Electrical, thermal and mechanical properties of poly-etherimide epoxy-diamine blendcitations
- 2017High temperature ageing of microelectronics assemblies with SAC solder jointscitations
- 2017Robustness of SiC MOSFET under avalanche conditionscitations
- 2016Vertical Termination Filled with Adequate Dielectric for SiC Devices in HVDC Applicationscitations
- 2013Die attach using silver sintering. Practical implementation and analysiscitations
- 2012Full densification of Molybdenum powders using Spark Plasma Sinteringcitations
- 2012Sintered molybdenum for a metallized ceramic substrate packaging for the wide-bandgap devices and high temperature applicationscitations
- 20123-Dimensional, Solder-Free Interconnect Technology for high-Performance Power Modules
- 2011Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization
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