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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Lazar, Mihai
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 2024Low Resistivity Aluminum Doped Layers Formed Using High Dose High Temperature Implants and Laser Annealing
- 2024Formation of Highly Doped and Defect-Free P-Type Junctions in SiC by Using High Temperature Implants and UV-Laser Annealing
- 2023Full-SiC Single-Chip Buck and Boost MOSFET-JBS Converters for Ultimate Efficient Power Vertical Integration
- 2022Surface engineering for SiC etching with Ni electroplating maskscitations
- 2016Improvements in Realizing 4H-SiC Thermal Neutron Detectorscitations
- 20164H-SiC Neutron Sensors Based on Ion Implanted 10 B Neutron Converter Layercitations
- 2016Vertical Termination Filled with Adequate Dielectric for SiC Devices in HVDC Applicationscitations
- 2016A Study on the Temperature of Ohmic Contact to p-Type SiC Based on Ti 3 SiC 2 Phase ; Une étude de la température de contact ohmique sur SiC de type p à basée sur la phase Ti3SiC2citations
- 2015Study of the Stability of 4H-SiC Detectors by Thermal Neutron Irradiationcitations
- 2012Observation of the generation of stacking faults and active degradation measurements on off-axis and on-axis 4H-SiC PiN diodescitations
- 20124H-SiC P + N UV Photodiodes : A Comparison between Beam and Plasma Doping Processescitations
- 2012SIMS Analyses Applied to Open an Optical Window in 4H-SiC Devices for Electro-Optical Measurementscitations
- 2012Investigations on Ni-Ti-Al Ohmic Contacts Obtained on P-Type 4H-SiCcitations
- 2011Investigations on Ni-Ti-Al ohmic contacts obtained on p-type 4H-SiCcitations
- 2011Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization
- 2011Modeling, Fabrication, and Characterization of Planar Inductors on YIG Substratescitations
- 2002A Comparative Study of High-Temperature Aluminum Post-Implantation Annealing in 6H- and 4H-SiC, Non-Uniform Temperature Effectscitations
- 2001Bipolar silicon carbide power diodes realized by aluminum implantations and high temperature rf-annealing
Places of action
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