693.932 PEOPLE
| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Lefebvre, Stéphane
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (11/11 displayed)
- 2017Mechanisms of power module source metal degradation during electro-thermal agingcitations
- 2016Surface analysis of smart power top metal: IR thermalmeasurement and source potential mappingcitations
- 2015In-depth investigation of metallization aging in power MOSFETscitations
- 2011Effect of die metallization layer ageing in the case of power semiconductor devices
- 2011A study of the effect of degradation of the aluminium metallization layer in the case of power semiconductor devices
- 2009Characterisation of power modules ceramic substrates for reliability aspects
- 2009Investigations on ageing of IGBT transistors under repetitive short-circuits operations
- 2009Thermal fatigue and failure of electronic power device substratescitations
- 2008Temperature Levels Effect on Solder Lifetime During Thermal Cycling of Power Modulescitations
- 2006Evaluation of Substrate Technologies under High Temperature Cycling
- 2006Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cyclingcitations
Places of action
| Organizations | Location | People |
|---|