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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Dupont, Laurent
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (11/11 displayed)
- 2024Proof-of-Concept for an On-Chip Kelvin-Emitter RTD Sensor for Junction Temperature Monitoring of IGBTscitations
- 2023Stretchable piezoresistive textile yarn strain transducer for low deformation detectioncitations
- 2022Sensitive stretchable textile transducer based on Lycra1880/PEGDA/PEDOT:PSScitations
- 2018From drifting polyaniline sensor to accurate sensor array for breath analysiscitations
- 2018Polyaniline nanocomposites based sensor array for breath ammonia analysis. Portable e-nose approach to non-invasive diagnosis of chronic kidney diseasecitations
- 2017Electrothermal evaluation of single and multiple solder void effects on low-voltage Si MOSFET behavior in forward bias conditionscitations
- 2015Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Testcitations
- 2011Development and electrical characterization of a vertical electrical and thermal test chip (VTTC)citations
- 2009Innovative connectivity for double side cooling and connection of power dice in the context of automotive power mechatronic packaging for high power inverters
- 2006Evaluation of Substrate Technologies under High Temperature Cycling
- 2006Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cyclingcitations
Places of action
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