693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Hodaj, Fiqiri
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2025Brazing of zirconia to titanium using pure gold: Physicochemical aspects
- 2022High-Temperature Interdiffusion of Tantalum and Niobium with SiC for Processing Hybrid Metal/CMC Componentscitations
- 2022Voids formation and Cu3Sn growth mechanisms in Cu/Cu3Sn/Cu6Sn5 system under air in Cu/SnAg joints for microelectronic packagingcitations
- 2021Bubble formation and growth during Transient Liquid Phase Bonding in Cu/SnAg system for microelectronic packagingcitations
- 2018On the initial stages of solid state reactions in Ni/Sn-Ag solder system at 150-210 degrees Ccitations
- 2017Further insight into interfacial interactions in nickel/liquid Sn-Ag solder system at 230-350 A degrees Ccitations
- 2016The interaction between copper and TixNy at low temperaturecitations
- 2016Experimental contribution to the corium thermodynamic modelling – The U–Zr–Al–Ca–Si–O systemcitations
- 2015Oxygen self-diffusion in polycrystalline uranium–plutonium mixed oxide U0.55Pu0.45O2citations
- 2015Interfacial reactions and diffusion path in gold–tin–nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packagingcitations
- 2014Effect of intermetallic compound thickness on shear strength of 25 μm diameter Cu-pillarscitations
- 2014Ceramic processing of uranium–plutonium mixed oxide fuels (U1−yPuy)O2 with high plutonium contentcitations
- 2013Solidification and interfacial interactions in gold–tin system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packagingcitations
- 2011Flux-driven nucleation at interfaces during reactive diffusioncitations
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