693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Bauer, J.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (24/24 displayed)
- 2024A facile strategy for tuning the density of surface-grafted biomolecules for melt extrusion-based additive manufacturing applicationscitations
- 2022Low surface damage laser processing of silicon by laser-induced plasma etching (LIPE)citations
- 2019A numerical study on mitigation of flying dies in compression molding of microelectronic packages
- 2018Structural, Electronic, and Physical Properties of Solid-State Rare-Earth Boride Carbidescitations
- 2017Plasma-wall interaction studies within the EUROfusion consortium: progress on plasma-facing components development and qualificationcitations
- 2017Plasma–wall interaction studies within the EUROfusion consortium: progress on plasma-facing components development and qualification
- 2016High viscosity paste dosing for microelectronic applicationscitations
- 2016Development of a sensor concept to in situ measure process data in a transfer mold process
- 2016In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip packagecitations
- 2014Explanation of potential-induced degradation of the shunting type by Na decoration of stacking faults in Si solar cellscitations
- 2013From wafer level to panel level mold embeddingcitations
- 2013Smart power module molding advances: Evaluating high temperature suitability of molding compounds
- 2011Through mold vias for stacking of mold embedded packagescitations
- 2011Atomic-scale engineering of future high-k dynamic random access memory dielectricscitations
- 2011Research on efficiency limiting defects and defect engineering in silicon solar cells - results of the German research cluster SolarFocuscitations
- 2010Water diffusion in micro- and nano-particle filled encapsulantscitations
- 2010Nano- und micro sized filler particles for improved humidity resistance of encapsulantscitations
- 2009Biocompatible lab-on-substrate technology platformcitations
- 2009Plastic packaging for high temperature applications
- 2008Lamination and laser structuring for a microwell arraycitations
- 2008Nano-particle enhanced encapsulants for improved humidity resistancecitations
- 2007Microtechnology for realization of dielectrophoresis enhanced microwells for biomedical applicationscitations
- 2007Lamination and laser structuring for a DEP microwell array
- 2005Crystal Structures, Physical Properties and NMR Experiments on the Ternary Rare-Earth Metal Silicide Boride Compounds RE5Si~2B8 (RE = Y, Sm, Gd, Tb, Dy, Ho).citations
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