Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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1.080 Topics available

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977 Locations available

693.932 PEOPLE
693.932 People People

693.932 People

Show results for 693.932 people that are selected by your search filters.

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PeopleLocationsStatistics
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Ibrahim, Ali

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in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (12/12 displayed)

  • 2024A New Solution to the Grain Boundary Grooving Problem in Polycrystalline Thin Films When Evaporation and Diffusion Meet in Power Electronic Devicescitations
  • 2023New model of crack propagation of aluminium wire bonds in IGBT power modules under low temperature variations8citations
  • 2022An EBSD Study of Fatigue Crack Propagation in Bonded Aluminum Wires Cycled from 55°C to 85°C5citations
  • 2022Experimental Study on the Physical and Mechanical Characteristics of Roller Compacted Concrete Made with Recycled Aggregates3citations
  • 2020Remaining Useful Lifetime estimation for Electronic Power modules using an analytical degradation modelcitations
  • 2020Wire-bond Contact Degradation Modelling for Remaining Useful Lifetime Prognosis of IGBT Power Modulescitations
  • 2020Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling18citations
  • 2020Wire-bond contact degradation modeling for remaining useful lifetime prognosis of IGBT power modules9citations
  • 2018Analytical Solutions to the Problem of the Grain Groove Profile4citations
  • 2018Analysis of the degradation mechanisms occurring in the topside interconnections of IGBT power devices during power cycling12citations
  • 2013Power cycling ageing tests at 200°C of SiC assemblies for high temperature electronicscitations
  • 2013Power cycling aging tests at 200°C of SiC assemblies for high temperature electronicscitations

Places of action

Chart of shared publication
Hamieh, Tayssir
2 / 35 shared
Khatir, Zoubir
11 / 23 shared
Degrenne, Nicolas
4 / 4 shared
Lallemand, R.
1 / 1 shared
Halouani, Ayda
2 / 2 shared
Shqair, Mustafa
1 / 5 shared
Pichon, Pierre-Yves
1 / 1 shared
Kheirbek, Ali
1 / 1 shared
Asaad, Majed
1 / 1 shared
Wardeh, George
1 / 11 shared
Al Masry, Zeina
2 / 2 shared
Nazar, Mohamad
2 / 2 shared
Dornic, Nausicaa
2 / 2 shared
Degrenne, N.
1 / 1 shared
Mollov, S.
1 / 1 shared
Ingrosso, Damien
1 / 1 shared
Nazar, M.
1 / 1 shared
Al-Masry, Z.
1 / 1 shared
Mollov, Stefan
1 / 1 shared
Tran, Sh
1 / 1 shared
Ousten, Jean Pierre
1 / 1 shared
Ewanchuk, J.
1 / 1 shared
Chart of publication period
2024
2023
2022
2020
2018
2013

Co-Authors (by relevance)

  • Hamieh, Tayssir
  • Khatir, Zoubir
  • Degrenne, Nicolas
  • Lallemand, R.
  • Halouani, Ayda
  • Shqair, Mustafa
  • Pichon, Pierre-Yves
  • Kheirbek, Ali
  • Asaad, Majed
  • Wardeh, George
  • Al Masry, Zeina
  • Nazar, Mohamad
  • Dornic, Nausicaa
  • Degrenne, N.
  • Mollov, S.
  • Ingrosso, Damien
  • Nazar, M.
  • Al-Masry, Z.
  • Mollov, Stefan
  • Tran, Sh
  • Ousten, Jean Pierre
  • Ewanchuk, J.
OrganizationsLocationPeople