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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Ibrahim, Ali
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (12/12 displayed)
- 2024A New Solution to the Grain Boundary Grooving Problem in Polycrystalline Thin Films When Evaporation and Diffusion Meet in Power Electronic Devices
- 2023New model of crack propagation of aluminium wire bonds in IGBT power modules under low temperature variationscitations
- 2022An EBSD Study of Fatigue Crack Propagation in Bonded Aluminum Wires Cycled from 55°C to 85°Ccitations
- 2022Experimental Study on the Physical and Mechanical Characteristics of Roller Compacted Concrete Made with Recycled Aggregatescitations
- 2020Remaining Useful Lifetime estimation for Electronic Power modules using an analytical degradation model
- 2020Wire-bond Contact Degradation Modelling for Remaining Useful Lifetime Prognosis of IGBT Power Modules
- 2020Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cyclingcitations
- 2020Wire-bond contact degradation modeling for remaining useful lifetime prognosis of IGBT power modulescitations
- 2018Analytical Solutions to the Problem of the Grain Groove Profilecitations
- 2018Analysis of the degradation mechanisms occurring in the topside interconnections of IGBT power devices during power cyclingcitations
- 2013Power cycling ageing tests at 200°C of SiC assemblies for high temperature electronics
- 2013Power cycling aging tests at 200°C of SiC assemblies for high temperature electronics
Places of action
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