693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Khatir, Zoubir
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (23/23 displayed)
- 2024A New Solution to the Grain Boundary Grooving Problem in Polycrystalline Thin Films When Evaporation and Diffusion Meet in Power Electronic Devices
- 2023Non-intrusive electro-thermo-mechanical reduced model for diagnosis and prognostic on IGBT power modules
- 2023New model of crack propagation of aluminium wire bonds in IGBT power modules under low temperature variationscitations
- 2022An EBSD Study of Fatigue Crack Propagation in Bonded Aluminum Wires Cycled from 55°C to 85°Ccitations
- 2022Finite elements analyses of early-stage crack propagation in aluminum wire bonds due to power cyclingcitations
- 2020Remaining Useful Lifetime estimation for Electronic Power modules using an analytical degradation model
- 2020Wire-bond Contact Degradation Modelling for Remaining Useful Lifetime Prognosis of IGBT Power Modules
- 2020Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cyclingcitations
- 2020Wire-bond contact degradation modeling for remaining useful lifetime prognosis of IGBT power modulescitations
- 2020Thermal behaviour evolution of an IGBT module after aging measured by thermoreflectance
- 2018Analytical Solutions to the Problem of the Grain Groove Profilecitations
- 2018Analysis of the degradation mechanisms occurring in the topside interconnections of IGBT power devices during power cyclingcitations
- 2017Electrothermal evaluation of single and multiple solder void effects on low-voltage Si MOSFET behavior in forward bias conditionscitations
- 2013Top-metal ageing effects on electro-thermal distributions in an IGBT chip under short circuit conditions
- 2013Power cycling ageing tests at 200°C of SiC assemblies for high temperature electronics
- 2013Power cycling aging tests at 200°C of SiC assemblies for high temperature electronics
- 2011Development and electrical characterization of a vertical electrical and thermal test chip (VTTC)citations
- 2011Effect of die metallization layer ageing in the case of power semiconductor devices
- 2009Characterisation of power modules ceramic substrates for reliability aspects
- 2009Investigations on ageing of IGBT transistors under repetitive short-circuits operations
- 2008Temperature Levels Effect on Solder Lifetime During Thermal Cycling of Power Modulescitations
- 2006Evaluation of Substrate Technologies under High Temperature Cycling
- 2006Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cyclingcitations
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