693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Dussart, Remi
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Topics
Publications (11/11 displayed)
- 2024MHCD in N2-H2 mixtures: towards a localized plasma nitriding process?
- 2017Morphology control in thin films of PS: PLA homopolymer blends by dip-coating depositioncitations
- 2015Polymer masks for structured surface and plasma etchingcitations
- 2014Submicrometric structured silicon surfaces obtained from polymer blend film by silica replication and cryogenic plasma etching
- 2014Cryogenic etching of submicronic features in silicon using masks based on porous polymer films
- 2014Titanium oxide thin film growth by magnetron sputtering: Total energy flux and its relationship with the phase constitutioncitations
- 2013Energy transferred to the substrate surface during reactive magnetron sputtering of aluminum in Ar/O2 atmospherecitations
- 2013IR emission from the target during plasma magnetron sputter depositioncitations
- 2013Energy flux measurements at the substrate deposition during reactive and non-reactive magnetron sputter deposition processes
- 2011Alternating SiCl4/O2 passivation steps with SF6 etch steps for silicon deep etching
- 2009Cryogenic etching of n-type silicon with p+ doped walls with the TGZM process through the Al/Si eutectic alloycitations
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