693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Saadaoui, Mohamed
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2024High Performance Stretchable Wire Li‐Ion Batteriescitations
- 2019Optimization and characterization of inkjet-printed ferroelectric capacitor for human body detection
- 2018Fabrication of SnO 2 Flexible Sensor by Inkjet Printing Technologycitations
- 2018Synthesis and inkjet printing of sol–gel derived tin oxide ink for flexible gas sensing applicationcitations
- 2014Microstrain and residual stress in thin-films made from silver nanoparticles deposited by inkjet-printing technologycitations
- 2012Impact of variable frequency microwave and rapid thermal sintering on microstructure of inkjet-printed silver nanoparticlescitations
- 2012Selective Sintering of Inkjet-Printed Silver Inks Using Variable Frequency Microwave
- 2012Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packages
- 2011Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in Microelectronicscitations
- 2011Multilayer Printed 3D Resistors Fabricated by an In-Line Inkjet Process For RFID
- 2011Optimal sintering technologies applied to inkjet-printed silver nanoparticles for microelectronics applications
- 2011An Improved In-line Inkjet Printing Process for 3D Multilayer Passive Devices
- 2010Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packagescitations
Places of action
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