693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Zhang, Gq Kouchi
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2012A semi-analytic method for crack kinking analysis at isotropic bi-material interfaces
- 2009Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics
- 2008Effect of aging of packaging materials on die surface cracking of a SiP carrier
- 2006Virtual design and qualification of IC backend structures
- 2005Viscoelastic characterization of low-dielectric-constant SiLK films using nano-indentation in combination with finite element modeling
- 2005Microstructural damage analysis of SnAgCu solder joints and an assessment on indentation procedurescitations
- 2004Characterization and fatigue damage simulation in SAC solder jointscitations
- 2004Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation
Places of action
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