693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Xiao, A.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (12/12 displayed)
- 2011Temperature moisture and mode mixity dependent EMC-Copper (oxide) interfacial toughness
- 2010Delamination and combined compound cracking of EMC-copper interfaces
- 2010Temperature moisture and mode mixity dependent EMC- Copper (Oxide) interfacial toughness
- 2010Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces
- 2009How to fabricate specimens for silicon-to-molding compound interface adhesion measurementscitations
- 2009Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperaturescitations
- 2009Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperaturescitations
- 2009Establishing fracture properties of EMC-copper interfaces in the Visco-Elastic temperature regioncitations
- 2008Mixed mode interface characterization considering thermal residual stresscitations
- 2008Interfacial Fracture Properties and Failure Modeling for Microelectronicscitations
- 2008Interface characterization and failure modeling for Semiconductor packagescitations
- 2008Advanced Viscoelastic Material Model for Predicting Warpage of a QFN Panel
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