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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Inal, Karim
Laboratory of Microstructure Studies and Mechanics of Materials
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (21/21 displayed)
- 2022Micro-Indentation of oxidized low carbon steel to evaluate properties of oxides
- 2018Hypothetic impact of chemical bonding on the moisture resistance of amorphous SixNyHz by plasma-enhanced chemical vapor depositioncitations
- 2015Thermo-mechanical analysis of GaAs devices under temperature-humidity-bias testingcitations
- 2014Microstrain and residual stress in thin-films made from silver nanoparticles deposited by inkjet-printing technologycitations
- 2013INVESTIGATION OF BORON AND NITROGEN ION BEAM IMPLANTATION IN GOLD THIN FILMS FOR OHMIC MEMS SWITCH CONTACT IMPROVEMENT
- 2012Impact of variable frequency microwave and rapid thermal sintering on microstructure of inkjet-printed silver nanoparticlescitations
- 2012Selective Sintering of Inkjet-Printed Silver Inks Using Variable Frequency Microwave
- 2012Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packages
- 2011Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in Microelectronicscitations
- 2011Optimal sintering technologies applied to inkjet-printed silver nanoparticles for microelectronics applications
- 2010Microstructure evolution of gold thin films under spherical indentation for micro switches contact applications
- 2010A micromechanical interpretation of the temperature dependence of Beremin model parameters for french RPV steelcitations
- 2010Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packagescitations
- 2009Residual stress estimation in damascene copper interconnects using embedded sensorscitations
- 2009Modelling the behaviour of polycrystalline austenitic steel with twinning-induced plasticity effectcitations
- 2009Three scale modeling of the behavior of a 16MND5-A508 bainitic steel: Stress distribution at low temperaturescitations
- 2009Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applicationscitations
- 2008Micro-mechanical modeling of brittle fracture of French RPV steel - A comprehensive study of stress triaxiality effectcitations
- 2006Grain and phase stress criteria for behaviour and cleavage in duplex and bainitic steelscitations
- 2006A crystallographic approach of brittle fracture in the 16MND5 bainitic steel. In-situ X-ray diffraction and scanning electron microscope measurements at low temperatures
- 2004Stress distribution and cleavage analysis in a 16MnNiMo5 bainitic steel X-ray diffraction and multiscale polycrystalline modelling
Places of action
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