693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Giacomozzi, Flavio
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (19/19 displayed)
- 2024Enhancing the Deposition Rate and Uniformity in 3D Gold Microelectrode Arrays via Ultrasonic-Enhanced Template-Assisted Electrodeposition
- 2023Green synthesized silver nanoparticles functionalized interdigitated electrodes for bacterial sensing using non-faradaic electrochemical impedance spectroscopycitations
- 2021A novel additive manufacturing approach towards fabrication of multi-level three-dimensional microelectrode array for electrophysiological investigationscitations
- 2020Touch sensor based on flexible AlN piezocapacitor coupled with MOSFETcitations
- 2016Ultra-Thin Silicon based Piezoelectric Capacitive Tactile Sensorcitations
- 2014RF-MEMS packaging by using quartz caps and epoxy polymerscitations
- 2013RF-MEMS chip capping by dry film epoxy polymer
- 2013RF-MEMS devices packaging by using quartz caps and epoxy polymer sealing rings
- 2012RF-MEMS chip capping by dry film epoxy polymer
- 2012Through wafer via holes manufacturing by variable isotropy Deep RIE process for RF applicationscitations
- 2011Fabrication of Through-Wafer Interconnections by Gold Electroplating
- 2005RF-MEMS switching LC-tank network for multiband VCO
- 2004STRESS-STRAIN BEHAVIOUR OF ELECTROPLATED GOLD THIN FILMS
- 2004Novel Test structures for stress diagnosis in micromechanicscitations
- 2003Fabrication of a piston-type condenser microphone with structured polysilicon diaphragm
- 2003Stress characterization of electroplated gold layers for low temperature surface micromachining
- 2002Cr/Ni/Au multilayer films for high temperature MEMS applications
- 2001Microsystem Fabrication for Microphysiological Applications
- 2000Micromachined Dielectric Membranes for Microwave Applications
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