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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Wolf, J.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2023Sensitivity of Offline and Inline Indicators for Fiber Stretching in Continuous Polyacrylonitrile Stabilizationcitations
- 2022Introduction to DIN 4871: Qualification of NDT Personnel in Civil Engineering (NDT-CE)citations
- 2022A component method to delineate surgical spine implants for proton Monte Carlo dose calculation.citations
- 2017Combinaison X-FEM/CZM pour la modélisation numérique de la rupture ductile
- 2017Modélisation numérique de la rupture ductile par une approche couplant X-FEM et zone cohésive
- 2017Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposercitations
- 2008Profile of the wafer level ECD gold bumps under variable parameterscitations
- 2007Copper / Benzocyclobutene multi layer wiring - A Flexible base technology for wafer level integration of passive componentscitations
- 2007Evaluation of micro structured glass layers as dielectric-and passivation material for wafer level integrated thin film capacitors and resistorscitations
- 2003CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - interfacial reaction and bump shear strengthcitations
- 2002Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM)citations
- 2002Under bump metallurgy study for Pb-free bumpingcitations
- 2000First MCM-D modules for the b-physics layer of the ATLAS pixel detector
Places of action
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