693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Ecke, Ramona
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (9/9 displayed)
- 2021Simulations for nanoindentation on thin metal films and the potential influence of creepcitations
- 2020Nanoindentation as part of material characterization of thin metal filmscitations
- 2020On the relationship between SiF4plasma species and sample properties in ultra low-k etching processes
- 2016Characterisation of the barrier formation process of self-forming barriers with CuMn, CuTi and CuZr alloyscitations
- 2016Atomic layer deposition of ultrathin Cu2O and subsequent reduction to Cu studied by in situ x-ray photoelectron spectroscopycitations
- 20153D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bondingcitations
- 2012Growth of carbon nanotube forests between a bi-metallic catalyst layer and a SiO2 substrate to form a self-assembled carbon-metal heterostructurecitations
- 2010Carbon nanotubes for nanoscale low temperature flip chip connectionscitations
- 2009Copper oxide films grown by atomic layer deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO2citations
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