693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Guillemet, Thomas
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (10/10 displayed)
- 2021System in package embedding III-V chips by fan-out wafer-level packaging for RF applicationscitations
- 2021Films diamantés pour applications en packaging électronique de puissance ; Diamond-based heat spreaders for power electronic packaging applications
- 2020Films diamantés pour applications en packaging électronique de puissance ; Diamond-based heat spreaders for power electronic packaging applications
- 2018Formation of Cu nanodots on diamond surface to improve heat transfer in Cu/D compositescitations
- 2014Simple fabrication and characterization of discontinuous carbon fiber reinforced aluminum matrix composite for lightweight heat sink applicationscitations
- 2013Films diamantés pour applications en packaging électronique de puissance ; Diamond-based heat spreaders for power electronic packaging applications
- 2012Innovative process for submicronic Cu particle deposition onto various substratescitations
- 2012An innovative process to fabricate copper/diamond composite films for thermal management applicationscitations
- 2012The role of controlled interfaces in the thermal management of copper-carbon compositescitations
- 2012The role of controlled interfaces in the thermal management of copper-carbon compositescitations
Places of action
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