People | Locations | Statistics |
---|---|---|
Naji, M. |
| |
Motta, Antonella |
| |
Aletan, Dirar |
| |
Mohamed, Tarek |
| |
Ertürk, Emre |
| |
Taccardi, Nicola |
| |
Kononenko, Denys |
| |
Petrov, R. H. | Madrid |
|
Alshaaer, Mazen | Brussels |
|
Bih, L. |
| |
Casati, R. |
| |
Muller, Hermance |
| |
Kočí, Jan | Prague |
|
Šuljagić, Marija |
| |
Kalteremidou, Kalliopi-Artemi | Brussels |
|
Azam, Siraj |
| |
Ospanova, Alyiya |
| |
Blanpain, Bart |
| |
Ali, M. A. |
| |
Popa, V. |
| |
Rančić, M. |
| |
Ollier, Nadège |
| |
Azevedo, Nuno Monteiro |
| |
Landes, Michael |
| |
Rignanese, Gian-Marco |
|
Keller, J.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (13/13 displayed)
- 2023Analysis of humidity sensitivity of silicon strip sensors for ATLAS upgrade tracker, pre- and post-irradiationcitations
- 2022ATLAS ITk strip sensor quality control procedures and testing site qualificationcitations
- 2021Thermodynamic stability, phase separation and Ag grading in (Ag,Cu)(In,Ga)Se2 solar absorberscitations
- 2021Alkali dispersion in (Ag,Cu)(In,Ga)Se2 thin film solar cells – Insight from theory and experimentcitations
- 2018Spatially Resolved, Non-Destructive in-situ Detection of Interface Degradation by Remote Electrical Readout of an on-chip Thermal Pixel (Thixel) Matrixcitations
- 2018Volume imaging NDE and serial sectioning of carbon fiber compositescitations
- 2016Intra-stack sealing of tier interconnects using the interconnect alloycitations
- 2016In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip packagecitations
- 2015A novel and practical method for in-situ monitoring of interface delamination by local thermal diffusivity measurementcitations
- 2014In situ monitoring of interface delamination by the 3o-methodcitations
- 2007NanoDAC - Object deformation measurements for micro and nanotechnology applications
- 2004Determination of local stress intensity factor at crack tip using image correlation techniques
- 2004Characterization of materials with nanoscopic filler particles by AFM techniquescitations
Places of action
Organizations | Location | People |
---|