693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Michel, B.
Institut de Radioprotection et de Sûreté Nucléaire
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (37/37 displayed)
- 2021Assessment of three European fuel performance codes against the SUPERFACT-1 fast reactor irradiation experimentcitations
- 2015New set of convective heat transfer coefficients established for pools and validated against CLARA experiments for application to corium poolscitations
- 2009Bondenergie-Messung in situ während des Temperns beim Direktbonden von Glas und Silizium ; Surface energy measurement during annealing for glass and silicon fusion bonding
- 2009Influence of moisture on the time and temperature dependent properties of polymer systemscitations
- 2009Influence of nano composites on reliability and mechanical properties of moisture sensors
- 2009Determination of copper/EMC interface fracture toughness during manufacturing, moisture preconditioning and solder reflow process of semiconductor packages
- 2009Modeling cure shrinkage and viscoelasticity to enhance the numerical methods for predicting delamination in semiconductor packagescitations
- 2009Characterisation and modelling of the nanoindentation experiment in Au layerscitations
- 2009Effect of nonlinear hygro-thermal and residual stresses on the interfacial fracture in plastic IC packagescitations
- 2008Characterization of dual-stage moisture diffusion, residual moisture content and hygroscopic swelling of epoxy molding compoundscitations
- 2008Thermal test- and field cycling induced degradation and its Fe-based prediction for different SAC solderscitations
- 2008FEA Based Reliability Prediction for Different Sn-Based Solders Subjected to Fast Shear and Fatigue Loadingscitations
- 2008Investigation of fracture toughness and displacement fields of copper/polymer interface using image correlation technique
- 2007Fracture, delamination and fatigue evaluation within RSM/DOE concepts of enhanced smart systems
- 2007Low-cycle fatigue of Ag-based solders dependent on alloying composition and thermal cycle conditionscitations
- 2007Reliability of SnPb and Pb-free flip-chips under different test conditionscitations
- 2007Fatigue analysis of miniaturized lead-free solder contacts based on a novel test conceptcitations
- 2007NanoDAC - Object deformation measurements for micro and nanotechnology applications
- 2007Failure Analysis of Microelectronic Packages by Pulse IR Thermography
- 2006Digital image correlation of nanoscale deformation fields for local stress measurement in thin filmscitations
- 2006Lifetime prediction of SnPb and SnAgCu solder joints of chips on copper substrate based on crack propagation FE-analysiscitations
- 2006Thermo-mechanical Design of Resilient Contact Systems for Wafer Level Packagingcitations
- 2006Solder Fatigue at High-Power IGBT Modules
- 2006A FE-study of solder fatigue compared to microstructural damage evaluation by in-situ laser scanning and FIB microscopycitations
- 2006Experimental investigation for fracture analysis of solder joints in microelectronic and mems applications
- 2005Fracture and Fatigue Behaviour of MEMS related Micro Materials
- 2005A comparative study of solder fatigue evaluated by microscopic in-situ analysis, on-line resistance measurement and FE calculationscitations
- 2005Novel test concept for experimental lifetime prediction of miniaturized lead-free solder contactscitations
- 2004Determination of local stress intensity factor at crack tip using image correlation techniques
- 2004Characterization of materials with nanoscopic filler particles by AFM techniquescitations
- 2004Evaluation of the primary and secondary creep of SnPb solder joint using a modified grooved-lap test specimencitations
- 2003Thermo-mechanical reliability aspects and finite element simulation in packaging
- 2002Thermo-mechanical reliability of lead-free solder interconnectscitations
- 2002Generalized fracture mechanical integral concept J/sub G/ and its application in microelectronic packaging technologycitations
- 2000Measurement of Thermal Expansion in Micromaterials - cTest Microscopy
- 2000Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanismcitations
- 2000Time and Temperature Dependent Mechanical Characterization of Polymers for Microsystems Applications
Places of action
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