People | Locations | Statistics |
---|---|---|
Naji, M. |
| |
Motta, Antonella |
| |
Aletan, Dirar |
| |
Mohamed, Tarek |
| |
Ertürk, Emre |
| |
Taccardi, Nicola |
| |
Kononenko, Denys |
| |
Petrov, R. H. | Madrid |
|
Alshaaer, Mazen | Brussels |
|
Bih, L. |
| |
Casati, R. |
| |
Muller, Hermance |
| |
Kočí, Jan | Prague |
|
Šuljagić, Marija |
| |
Kalteremidou, Kalliopi-Artemi | Brussels |
|
Azam, Siraj |
| |
Ospanova, Alyiya |
| |
Blanpain, Bart |
| |
Ali, M. A. |
| |
Popa, V. |
| |
Rančić, M. |
| |
Ollier, Nadège |
| |
Azevedo, Nuno Monteiro |
| |
Landes, Michael |
| |
Rignanese, Gian-Marco |
|
Janczak-Rusch, J.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (24/24 displayed)
- 2023Thermally-induced microstructure evolution of Ag/AlN nano-multilayers: the role of annealing atmosphere on the Ag outflow driving forcecitations
- 2023The effect of the surface patterning by ion beam irradiation on the Ag directional outflow in Ag/AlN nano-multilayerscitations
- 2023Interfacial intermetallic growth and strength of composite lead-free solder alloy through isothermal agingcitations
- 2023A study of the shear response of a lead-free composite solder by experimental and homogenization techniquescitations
- 2021The effect of the graded bilayer design on the strain depth profiles and microstructure of Cu/W nano-multilayerscitations
- 2019Effect of the individual layer thickness on the transformation of Cu/W nano-multilayers into nanocompositescitations
- 2016Thermal stability of Cu/W nano-multilayerscitations
- 2016The effect of thermal treatment on the stress state and evolving microstructure of Cu/W nano-multilayerscitations
- 2015Structural evolution of Ag-Cu nano-alloys confined between AlN nano-layers upon fast heatingcitations
- 2014Theoretical analysis of melting point depression of pure metals in different initial configurationscitations
- 2014Direct glass-to-metal joining by simultaneous anodic bonding and soldering with activated liquid tin soldercitations
- 2012Modeling of multi-phase solid state reactions ― case of IMC growth
- 2012GP5- Modeling and experimental investigation of the microstructural changes in the interdiffusion zone of leadfree solder joints
- 2011Evolution of the microstructure of Sn-Ag-Cu solder joints exposed to ultrasonic waves during solidificationcitations
- 2011Thermodynamic justification for the Ni/Al/Ni joint formation by a diffusion brazingcitations
- 2011Meta-stable conditions of diffusion brazingcitations
- 2009A study of the shear response of a lead-free composite solder by experimental and homogenization techniquescitations
- 2008Interfacial intermetallic growth and strength of composite lead-free solder alloy through isothermal agingcitations
- 2008Formation of the Ni/Al/Ni joint structure applying an isothermal solidification
- 2008An elastoplastic three-dimensional homogenization model for particle reinforced compositescitations
- 2005Joining of SiC fibre reinforced borosilicate glass matrix composites to molybdenum by metal and silicate brazingcitations
- 2004Properties and fractography of Si 3 N 4 /TiN ceramic joined to steel with active single layer and double layer braze filler alloyscitations
- 2004Formation of the structure within Ni-Al alloys of a special application
- 2000Microstructure and properties of monazite (LaPO 4 ) coated saphikon fiber/alumina matrix compositescitations
Places of action
Organizations | Location | People |
---|