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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Schmitz, S.
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (11/11 displayed)
- 2015Microstructural evolution of ultrosonic-bonded aluminum wirescitations
- 2015Microstructural evolution of ultrasonic-bonded aluminum wirescitations
- 2014Stardust Interstellar Preliminary Examination IX: High-speed interstellar dust analog capture in Stardust flight-spare aerogelcitations
- 2013European R&D trends in wire bonding technologies
- 2011Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200 °ccitations
- 2010Interduffision and Kirkendall Voiding in the Contact System Au Ball Bond on Al Chip Metallization
- 2009Kirkendall voiding in Au ball bond interconnects on Al chip metallization in the temperature range from 100 - 200°C after optimized intermetallic coverage
- 2009Bistable Thin-Film Shape Memory Actuators for Applications in Tactile Displayscitations
- 2005Entwicklung von Formgedächtnis−Dünnschichtaktoren für haptische Anwendungen
- 2002Leakage current measurements of STO and BST thin films interpreted by the 'dead' layer model
- 2002Simulation of leakage current in thin films with dead layers
Places of action
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