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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Faes, Alessandro
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (9/9 displayed)
- 2014RF-MEMS packaging by using quartz caps and epoxy polymerscitations
- 2013RF-MEMS chip capping by dry film epoxy polymer
- 2013RF-MEMS devices packaging by using quartz caps and epoxy polymer sealing rings
- 2012RF-MEMS chip capping by dry film epoxy polymer
- 2012Modeling of gold microbeams as strain and pressure sensors for characterizing MEMS packagescitations
- 2011Modeling of gold microbeams for characterizing MEMS packages
- 2004Novel Test structures for stress diagnosis in micromechanicscitations
- 2003Fabrication of a piston-type condenser microphone with structured polysilicon diaphragm
- 2003Stress characterization of electroplated gold layers for low temperature surface micromachining
Places of action
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