693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Salleh, Mohd Arif Anuar Mohd
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (7/7 displayed)
- 2022Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Reviewcitations
- 2022Controlling the Layer Thickness of Zinc Oxide Photoanode and the Dye-Soaking Time for an Optimal-Efficiency Dye-Sensitized Solar Cellcitations
- 2022Preliminary investigation on the correlation between mechanical properties and conductivity of low-density polyethylene/carbon black (LDPE/CB) conductive polymer composite (CPC)citations
- 2021Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealingcitations
- 2020Effect of Bismuth Additions on Wettability, Intermetallic Compound, and Microhardness Properties of Sn-0.7Cu on Different Surface Finish Substratescitations
- 2020Bonding Strength Characteristics of FA-Based Geopolymer Paste as a Repair Material When Applied on OPC Substratecitations
- 2019Current advancement in electrically conductive polymer composites for electronic interconnect applications: A short reviewcitations
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