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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Feuchter, Michael
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (14/14 displayed)
- 2024Morphological structure and mechanical properties of a nucleated Polyoxymethylene (POM) homopolymer resin processed under conventional injection molding conditions
- 2024Impact Characteristics and Repair Approaches of Distinct Bio-Based Matrix Composites: A Comparative Analysiscitations
- 2024Effect of different weft-knitted structures on the mechanical performance of bio-based flexible compositescitations
- 2024Manufacturing bio-based fiber-reinforced polymer composites: Process performance in RTM and VARI processescitations
- 2023Impact of Multiple Reprocessing on Properties of Polyhydroxybutyrate and Polypropylenecitations
- 2023Tensile properties of flexible composites with knitted reinforcements from various yarn materialscitations
- 2023Investigation of the Mechanical Properties of Sandwich Composite Panels Made with Recyclates and Flax Fiber/Bio-Based Epoxy Processed by Liquid Composite Moldingcitations
- 2022Dynamic mechanical response in epoxy nanocomposites incorporating various nano-silica architectures
- 2022Towards virtually optimized curing cycles for polymeric encapsulations in microelectronicscitations
- 2022Injection Molding Simulation of Polyoxymethylene Using Crystallization Kinetics Data and Comparison with the Experimental Processcitations
- 2021Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fibre Reinforced Epoxy Laminates
- 2021Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronicscitations
- 2020Exploiting the Carbon and Oxa Michael Addition Reaction for the Synthesis of Yne Monomerscitations
- 2018Influence of environmental factors like temperature and humidity on MEMS packaging materials.citations
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