693.932 PEOPLE
| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Bleiker, Simon J.
KTH Royal Institute of Technology
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (7/7 displayed)
- 2022Wafer-level hermetically sealed silicon photonic MEMScitations
- 2022Wafer-level hermetically sealed silicon photonic MEMScitations
- 2018Through-Glass Vias for MEMS Packaging
- 2017Wafer-level vacuum packaging enabled by plastic deformation and low-temperature welding of copper sealing rings with a small footprintcitations
- 2015Nanoelectromechanical digital logic circuits using curved cantilever switches with amorphous-carbon-coated contactscitations
- 2014Amorphous carbon active contact layer for reliable nanoelectromechanical switchescitations
- 2012Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wirescitations
Places of action
| Organizations | Location | People |
|---|