693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Desmulliez, Mpy
Heriot-Watt University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (49/49 displayed)
- 2023Low-power laser manufacturing of copper tracks on 3D printed geometry using liquid polyimide coatingcitations
- 2022Multimaterial 3D Printing Technique for Electronic Circuitry Using Photopolymer and Selective Metallizationcitations
- 2020Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVscitations
- 2020Light based synthesis of metallic nanoparticles on surface-modified 3D printed substrates for high performance electronic systemscitations
- 2019A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applicationscitations
- 2019A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications
- 2019Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocompositecitations
- 2019Photolithographic nanoseeding method for selective synthesis of metal-catalysed nanostructurescitations
- 2019Miniaturized 3-D Cross-Type Receiver for Wirelessly Powered Capsule Endoscopycitations
- 2019Selective metallisation of 3D printable thermoplastic polyurethanescitations
- 2018Nanocomposite-Based Microstructured Piezoresistive Pressure Sensors for Low-Pressure Measurement Rangecitations
- 2018A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimidecitations
- 2018Hybrid Additive Manufacture of Conformal Antennascitations
- 2016Progress towards a multi-modal capsule endoscopy device featuring microultrasound imagingcitations
- 2016Carbon screen-printed electrodes on ceramic substrates for label-free molecular detection of antibiotic resistancecitations
- 2016A wafer mapping technique for residual stress in surface micromachined filmscitations
- 2015Electrodeposited magnetostrictive Fe-Ga alloys for miniaturised actuatorscitations
- 2015Microwave and thermal curing of an epoxy resin for microelectronic applicationscitations
- 2015Computational electrohydrodynamics in the fabrication of hollow polymer microstructurescitations
- 2015Fabrication of electrodeposited Ni-Fe cantilevers for magnetic MEMS switch applicationscitations
- 2014Characterization and Development of Materials for an Integrated High-Temperature Sensor Using Resistive Test Structures
- 2014Integration of Microfluidic Channels with Frequency Selective Surfaces for Sensing and Tuningcitations
- 2014Statistical analysis of stencil technology for wafer-level bumpingcitations
- 2013Test structures for electrical evaluation of high aspect ratio TSV arrays fabricated using planarised sacrificial photoresistcitations
- 2013Microstructure formation in a thick polymer by electrostatic-induced lithographycitations
- 2012On the Use of Silver Nanoparticles for Direct Micropatterning on Polyimide Substratescitations
- 2012Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
- 2011Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitationcitations
- 2011Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications
- 2011Design, Manufacturing and Packaging of High Frequency Micro Ultrasonic Transducers for Medical Applications
- 2011Hermetic glass frit packaging in air and vacuum with localized laser joiningcitations
- 2010An additive method for photopatterning of metals on flexible substratescitations
- 2010Influence of pulse reverse plating on the properties of Ni-Fe thin filmscitations
- 2010Bespoke interconnect technologies for optoelectronic and biomedical products
- 2010Silver nanocluster formation using UV radiation for direct metal patterning on polyimidecitations
- 2010High-aspect-ratio metal microchannel plates for microelectronic cooling applicationscitations
- 2010Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithographycitations
- 2009Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling platecitations
- 2009Design, fabrication, and characterization of flip-chip bonded microinductorscitations
- 2009Design methodology and fabrication process of a microinductor for the next generation of DC-DC power converterscitations
- 2009High density indium bumping using electrodeposition enhanced by megasonic agitationcitations
- 2008Adaptive packaging solution for a microlens array placed over a micro-UV-LED arraycitations
- 2008Design methodology and manufacture of a microinductorcitations
- 2008Megasonic enhanced electrodepositioncitations
- 2008Open-ended microwave oven for flip-chip assemblycitations
- 2008Megasonic enhanced wafer bumping process to enable high density electronics interconnectioncitations
- 2006Assessment of microinductors for DC-DC converters
- 2004Design, manufacture and testing of a low-cost micro-channel cooling device
- 2004Design, manufacture and testing of a low-cost micro-channel cooling device
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