693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Jansen, Kaspar
Delft University of Technology
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (48/48 displayed)
- 2024Design and modelling of a reversible shape memory alloy torsion hinge actuatorcitations
- 2024Mimosa
- 2023Affine Deformation and Self-Assembly Alignment in Hydrogel Nanocomposites
- 2023Shape memory alloy actuators for haptic wearablescitations
- 2022The unfolding of textileness in animated textiles:citations
- 2022Multi-scale experimental testing on variable stiffness and damping components for semi-active structural controlcitations
- 2021Experimental testing on semi-active vibration control through adaptive structural joints
- 2021Multi-scale experimental testing on variable stiffness and damping components for semi-active structural controlcitations
- 20214D printing of reconfigurable metamaterials and devices
- 2020Design and characterization of variable stiffness structural jointscitations
- 2019Characterization of variable stiffness joints for adaptive structurescitations
- 2018Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditionscitations
- 2017Modelling of Thermal Aging of Moulding Compound by using an Equivalent Layer Assumptioncitations
- 2016Mechanical characterization of a shape morphing smart composite with embedded shape memory alloys in a shape memory polymer matrixcitations
- 2016Water Sorption and Diffusion in (Reduced) Graphene Oxide-Alginate Biopolymer Nanocompositescitations
- 2016Functional Demonstrators to Support Understanding of Smart Materialscitations
- 2016Numerical investigation and experimental validation of residual stresses building up in microelectronics packagingcitations
- 2016Thermo-viscoelastic analysis of GLAREcitations
- 2016Composition dependent properties of graphene (oxide)-alginate biopolymer nanocompositescitations
- 2016Effect of fiber-matrix adhesion on the creep behavior of CF/PPS compositescitations
- 2011Delamination Toughness of Cu-EMC Interfaces at Harsh Environment
- 2011Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound
- 2011Analytical estimate for cure-induced stresses and warpage in flat packages
- 2010High temperature storage influence on molding compound properties
- 2010Prediction of cure induced warpage of micro-electronic products
- 2010Theory of aluminum metallization corrosion in microelectronics
- 2010Delamination and combined compound cracking of EMC-copper interfaces
- 2010Interfacial fracture parameters of silicon-to-molding compound
- 2010Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces
- 2010Thermal aging of molding compounds
- 2009Modeling and characterization of molding compound properties during cure
- 2009Influence of cure dependency of molding compound properties on warpage and stress distribution during and after the encapsulation of electronics componentscitations
- 2009Investigation on Thermal Properties of Crosslinked Epoxy Resin by MD Simulation
- 2009Cure induced Warpage of micro-electronics: comparison with experiments
- 2009Moisture absorption and hygroscopic swelling characterization of molding compound
- 2009Comprehensive material characterization of organic packaging materialscitations
- 2009Effect of Postcure and Thermal Aging on Molding Compound Properties
- 2008Effect of aging of packaging materials on die surface cracking of a SiP carrier
- 2008Interfacial Fracture Properties and Failure Modeling for Microelectronicscitations
- 2008A Characterization Method for Viscoelastic Bulk Modulus of Molding Compounds
- 2008Advanced Viscoelastic Material Model for Predicting Warpage of a QFN Panel
- 2008Characterization and modeling of molding compound properties during cure
- 2007Correlation between chemistry of polymer building blocks and microelectronics reliability
- 2007Effect of filler concentration of rubbery shear and bulk modulus of molding compounds
- 2007Measuring the through-plane elastic modulus of thin polymer films in situ
- 2007Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques
- 2007Characterization of moisture properties of polymers for IC packaging
- 2005State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
Places of action
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