693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Nogita, Kazuhiro
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2021Microstructure Evolution of Ag/TiO2 Thin Filmcitations
- 2020Effect of Na and Cooling Rate on the Activation of Mg–Ni Alloys for Hydrogen Storagecitations
- 2016Critical properties of Cu6Sn5 in electronic devices: Recent progress and a reviewcitations
- 2013Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planescitations
- 2012A new phase in stoichiometric Cu6Sn5citations
- 2010Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interfacecitations
- 2009Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substratescitations
- 2008Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces
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