693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Niklaus, Frank
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (19/19 displayed)
- 2023Three-dimensional printing of silica glass with sub-micrometer resolutioncitations
- 2023Three-dimensional printing of silica glass with sub-micrometer resolutioncitations
- 2022Wafer-level hermetically sealed silicon photonic MEMScitations
- 2022Wafer-level hermetically sealed silicon photonic MEMScitations
- 2020Bactericidal surfaces prepared by femtosecond laser patterning and layer-by-layer polyelectrolyte coatingcitations
- 2019Transfer printing of nanomaterials and microstructures using a wire bondercitations
- 2018Direct observation of grain boundaries in graphene through vapor hydrofluoric acid (VHF) exposurecitations
- 2018Through-Glass Vias for MEMS Packaging
- 2017Inkjet printing technology for increasing the I/O density of 3D TSV interposerscitations
- 2017Wafer-level vacuum packaging enabled by plastic deformation and low-temperature welding of copper sealing rings with a small footprintcitations
- 2015Nanoelectromechanical digital logic circuits using curved cantilever switches with amorphous-carbon-coated contactscitations
- 2015CMOS-Integrated Si/SiGe Quantum-Well Infrared Microbolometer Focal Plane Arrays Manufactured With Very Large-Scale Heterogeneous 3-D Integrationcitations
- 2013Electromechanical Piezoresistive Sensing in Suspended Graphene Membranescitations
- 2013Unconventional applications of wire bonding create opportunities for microsystem integrationcitations
- 2013Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE(+) dual-cure polymercitations
- 2012Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substratescitations
- 2012Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wirescitations
- 2011Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wirescitations
- 2011Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technologycitations
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