693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Vuorinen, Vesa
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (48/48 displayed)
- 2024Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliabilitycitations
- 2024Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packagingcitations
- 2024Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration
- 2024Bonding of ceramics to silver-coated titanium—A combined theoretical and experimental study
- 2024Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnectscitations
- 2024Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Testcitations
- 2023Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICscitations
- 2023Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °Ccitations
- 2023Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristicscitations
- 2023Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integrationcitations
- 2022Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bondingcitations
- 2022Finite element simulation of solid-liquid interdiffusion bonding process: Understanding process dependent thermomechanical stresscitations
- 2022Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packagingcitations
- 2022Finite element simulation of solid-liquid interdiffusion bonding processcitations
- 2022Aluminium corrosion in power semiconductor devicescitations
- 2021Wafer Level Solid Liquid Interdiffusion Bondingcitations
- 2021A humidity-induced novel failure mechanism in power semiconductor diodescitations
- 2021Low-temperature Metal Bonding for Optical Device Packagingcitations
- 2019The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formationcitations
- 2018Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMScitations
- 2018The effect of platinum contact metallization on Cu/Sn bondingcitations
- 2018Wafer-Level AuSn/Pt Solid-Liquid Interdiffusion Bondingcitations
- 2017XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connectscitations
- 2017Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connectscitations
- 2017Key parameters influencing Cu-Sn interfacial void formation
- 2016Optimization of contact metallizations for reliable wafer level Au[sbnd]Sn bondscitations
- 2016Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)-Sn systemcitations
- 2016Void formation and its impact on Cu-Sn intermetallic compound formationcitations
- 2016Structural and chemical analysis of annealed plasma-enhanced atomic layer deposition aluminum nitride filmscitations
- 2016Structural and chemical analysis of annealed plasma-enhanced atomic layer deposition aluminum nitride filmscitations
- 2016Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnectionscitations
- 2014Phase evolution in the AuCu/Sn system by solid-state reactive diffusioncitations
- 2014Void formation in Cu-Sn SLID bonding for MEMScitations
- 2011Diffusion and growth of the µ phase (Ni6Nb7) in the Ni-Nb systemcitations
- 2010Study on the growth of Nb3Sn superconductor in Cu(Sn)/Nb diffusion couple
- 2010Impurity and alloying effects on interfacial reaction layers in Pb-free solderingcitations
- 2009Combined thermodynamic-kinetic analysis of the interfacial reactions between Ni metallization and various lead-free solderscitations
- 2009Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layerscitations
- 2009Determination of diffusion parameters and activation energy of diffusion in V3Si phase with A15 crystal structurecitations
- 2009Understanding materials compatibility issues in electronics packaging
- 2008Formation of Intermetallic Compounds Between Liquid Sn and Various CuNix Metallizationscitations
- 2007Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock testscitations
- 2007Solid-state reactions between Cu(Ni) alloys and Sncitations
- 2006Phase formation between lead-free Sn-Ag-Cu solder and Ni(P)/Au finishescitations
- 2006Interfacial reactions between Sn-based solders and common metallisations used in electronics
- 2005Analysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solderscitations
- 2005Interfacial reactions between lead-free solders and common base materialscitations
- 2004Analyses of interfacial reactions at different levels of interconnectioncitations
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