693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Stemme, Göran
KTH Royal Institute of Technology
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (18/18 displayed)
- 2023Three-dimensional printing of silica glass with sub-micrometer resolutioncitations
- 2023Three-dimensional printing of silica glass with sub-micrometer resolutioncitations
- 2022Wafer-level hermetically sealed silicon photonic MEMScitations
- 2022Wafer-level hermetically sealed silicon photonic MEMScitations
- 2018Through-Glass Vias for MEMS Packaging
- 2017Wafer-level vacuum packaging enabled by plastic deformation and low-temperature welding of copper sealing rings with a small footprintcitations
- 2013Pt-Al2O3 dual layer atomic layer deposition coating in high aspect ratio nanoporescitations
- 2013Wafer-level integration of NiTi shape memory alloy on silicon using Au-Si eutectic bondingcitations
- 2013Unconventional applications of wire bonding create opportunities for microsystem integrationcitations
- 2012Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substratescitations
- 2012A low-power high-flow shape memory alloy wire gas microvalvecitations
- 2012Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wirescitations
- 2011Electrochemically Assisted Maskless Selective Removal of Metal Layers for Three-Dimensional Micromachined SOI RF MEMS Transmission Lines and Devicescitations
- 2011Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wirescitations
- 2011Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technologycitations
- 2010Design and wafer-level fabrication of SMA wire microactuators on siliconcitations
- 2009Wafer-Scale Manufacturing of Bulk Shape-Memory-Alloy Microactuators Based on Adhesive Bonding of Titanium-Nickel Sheets to Structured Silicon Waferscitations
- 2009FULL WAFER INTEGRATION OF SHAPE MEMORY ALLOY MICROACTUATORS USING ADHESIVE BONDINGcitations
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