693.932 PEOPLE
| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Van Driel, Willem
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (20/20 displayed)
- 2024Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification
- 2023Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Applicationcitations
- 2022Interphase effect on the effective moisture diffusion in epoxy–SiO2 compositescitations
- 2021Facile synthesis of ag nanowire/tio2 and ag nanowire/tio2/go nanocomposites for photocatalytic degradation of rhodamine bcitations
- 2021Exploring water and ion transport process at silicone/copper interfaces using in-situ electrochemical and Kelvin probe approachescitations
- 2018Solid State Lighting Reliability Part 2
- 2016Creep fatigue models of solder jointscitations
- 2015An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic componentscitations
- 2010Designing for reliability using a new Wafer Level Package structure
- 2009Virtual Prototyping for PPM-level Failures in Microelectronic Packages
- 2009Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding
- 2008Effect of aging of packaging materials on die surface cracking of a SiP carrier
- 2008Die Fracture Probability Prediction and Design Guidelines for Laminate-Based Over-Molded Packages
- 2007Modeling of the mechanical stiffness of the GaP/GaAs nanowires with point defects/stacking faults
- 2007Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion
- 2007Correlation between chemistry of polymer building blocks and microelectronics reliability
- 2007Measuring the through-plane elastic modulus of thin polymer films in situ
- 2007Characterization of moisture properties of polymers for IC packaging
- 2006Mixed Mode Bending Test for Interfacial Adhesion in Semiconductor Applications
- 2005The precision of large radio continuum source catalogues. An application of the SPECFIND toolcitations
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