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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Dong, Hongqun
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (9/9 displayed)
- 2022Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bondingcitations
- 2021Wafer Level Solid Liquid Interdiffusion Bondingcitations
- 2020The impact of residual stress on resonating piezoelectric devicescitations
- 2020The impact of residual stress on resonating piezoelectric devicescitations
- 2018The effect of platinum contact metallization on Cu/Sn bondingcitations
- 2016Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)-Sn systemcitations
- 2016Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnectionscitations
- 2013Reliability of wafer-level SLID bonds for MEMS encapsulation
- 2011Diffusion and growth of the µ phase (Ni6Nb7) in the Ni-Nb systemcitations
Places of action
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