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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Verdingovas, Vadimas
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (8/8 displayed)
- 2020Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloyscitations
- 2019Electrochemical Impedance Spectroscopy (EIS) for Monitoring the Water Load on PCBAs Under Cycling Condensing Conditions to Predict Electrochemical Migration Under DC Loadscitations
- 2018Humidity-related failures in electronics: effect of binary mixtures of weak organic acid activatorscitations
- 2018Corrosion Reliability of Lead-Free Solder Systems Used in Electronicscitations
- 2017Corrosion reliability of lead-free solder systems used in electronicscitations
- 2015Effect of iodine on the corrosion of Au-Al wire bondscitations
- 2014Corrosion in electronics: Overview of failures and countermeasures
- 2013Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics
Places of action
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