| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Guillemet, Thomas
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (10/10 displayed)
- 2021System in package embedding III-V chips by fan-out wafer-level packaging for RF applicationscitations
- 2021Films diamantés pour applications en packaging électronique de puissance ; Diamond-based heat spreaders for power electronic packaging applications
- 2020Films diamantés pour applications en packaging électronique de puissance ; Diamond-based heat spreaders for power electronic packaging applications
- 2018Formation of Cu nanodots on diamond surface to improve heat transfer in Cu/D compositescitations
- 2014Simple fabrication and characterization of discontinuous carbon fiber reinforced aluminum matrix composite for lightweight heat sink applicationscitations
- 2013Films diamantés pour applications en packaging électronique de puissance ; Diamond-based heat spreaders for power electronic packaging applications
- 2012Innovative process for submicronic Cu particle deposition onto various substratescitations
- 2012An innovative process to fabricate copper/diamond composite films for thermal management applicationscitations
- 2012The role of controlled interfaces in the thermal management of copper-carbon compositescitations
- 2012The role of controlled interfaces in the thermal management of copper-carbon compositescitations
Places of action
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thesis
Films diamantés pour applications en packaging électronique de puissance ; Diamond-based heat spreaders for power electronic packaging applications
Abstract
Ce travail de thèse porte sur le développement de films diamantés pour des applications de dissipation de chaleur dans les circuits électroniques de puissance. Dans le cadre d’un accord de cotutelle franco-américain, une approche duale a été adoptée. En France, la fabrication de films composites à matrice cuivre et renforts diamant par métallurgie des poudres a été privilégiée. Aux Etats-Unis, les efforts se sont concentrés sur la croissance de films de diamant par une méthode de combustion de flamme assistée laser. Dans chacune des approches, les corrélations entre microstructure et interfaces (microscopies à balayage et à transmission), composition chimique (spectroscopies Auger, Raman, XPS), et propriétés thermiques (radiométrie flash laser, radiométrie photothermique infrarouge, dilatométrie, cyclage thermique) ont été établies. Enfin, la simulation du comportement des matériaux en situation de fonctionnement opératoire à été abordée. ; This PhD work deals with the development of diamond-based heat-spreading films for power electronic packaging applications. In the frame of a French-American dual PhD agreement, a double research approach was adopted. In France, the fabrication of copper-matrix diamond-reinforced composite films through tape casting and hot pressing has been endeavoured. In the US, the efforts were focused on the growth of diamond films through laser-assisted combustion synthesis. In both cases, relationships between the microstructure and the interfaces (scanning and transmission electron microscopy), the chemical composition (Auger, Raman, and XPS spectroscopy), and the thermal properties (flash laser radiometry, infrared photothermal radiometry, dilatometry, thermal cycling) of the final materials were established. Finally, the behaviour of the materials in operating environment was simulated.