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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Caruso, Rachel
in Cooperation with on an Cooperation-Score of 37%
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Publications (4/4 displayed)
- 2016Parameters responsible for the degradation of CH3NH3PbI3-based solar cells on polymer substratescitations
- 2015Encapsulation for Improving the Lifetime of Flexible Perovskite Solar Cellscitations
- 2015Encapsulation for Improving the Lifetime of Flexible Perovskite Solar Cells
- 2012Surface modified titanium zirconium oxide nanofiber web as a heavy metal ion adsorbent for water remediation applications
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article
Encapsulation for Improving the Lifetime of Flexible Perovskite Solar Cells
Abstract
he effect of encapsulation on improving the operational lifetime of flexible perovskite-based solar cells prepared on polymer substrates is presented. The devices were fabricated on substrates comprising polyethylene terephthalate film coated with indium-doped zinc oxide, with using mesoporous TiO2 nanoparticles as the electron-transport layer and 2,2',7,7'-tetrakis-(N,N-di-p-methoxyphenylamine)-9,9'-spirobifluorene as the hole-transport layer. The stability of non-encapsulated devices and devices encapsulated using two different architectures, referred to in the present work as ‘partial’ and ‘complete’ encapsulation, were evaluated on exposure to ambient conditions. The lifetime of the encapsulated flexible PSC devices was extended significantly compared with that of the non-encapsulated devices. Permeation testing revealed that the post-encapsulation ingress of moisture through the adhesive layers and around electrical contacts constitutes a significant lifetime-limiting factor. Impedance spectroscopy analysis indicates a gradual increase in the charge-transfer resistance at one of the device interfaces during degradation. These findings highlight the importance of continued development of the encapsulation architectures to further prolong device lifetime.