| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Vanfleteren, Jan
IMEC
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (24/24 displayed)
- 2023Methods to improve accuracy of electronic component positioning in thermoformed electronicscitations
- 2022Innovative component positioning method for thermoformed electronicscitations
- 2022A study on over-molded copper-based flexible electronic circuitscitations
- 2021Fully integrated flexible dielectric monitoring sensor system for real-time in situ prediction of the degree of cure and glass transition temperature of an epoxy resincitations
- 2020Flexible microsystems using over-molding technologycitations
- 2020Solar cells integration in over-molded printed electronicscitations
- 2019Effect of overmolding process on the integrity of electronic circuitscitations
- 20183D multifunctional composites based on large-area stretchable circuit with thermoforming technologycitations
- 2017Stretchable electronic platform for soft and smart contact lens applicationscitations
- 2017Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymerscitations
- 2016One-time deformable thermoplastic devices based on flexible circuit board technologycitations
- 2016RTM Production Monitoring of the A380 Hinge Arm Droop Nose Mechanism: A Multi-Sensor Approachcitations
- 2016Stretchable electronic platform for soft and smart contact lens applications
- 2015Design, construction and testing of a COC 3D flow-over flow-through bioreactor for hepatic cell culture
- 2015Deformable microsystem for in situ cure degree monitoring of GFRP(Glass Fibre Reinforced Plastic)
- 20152.5D smart objects using thermoplastic stretchable interconnectscitations
- 2015Free-form 2.5D thermoplastic circuits using one-time stretchable interconnections
- 2013Stretchable electronics technology for large area applications: fabrication and mechanical characterizationcitations
- 2013Parylene C for hermetic and flexible encapsulation of interconnects and electronic components
- 2012Biocompatible packaging solutions for implantable electronic systems for medical applications
- 2011The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnectscitations
- 20113D-stacking of UTCPs as a module miniaturization technology
- 2007Design of metal interconnects for stretchable electronic circuits using finite element analysiscitations
- 2002An O/E measurement probe based on an optics-extended MCM-D motherboard technology
Places of action
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document
Parylene C for hermetic and flexible encapsulation of interconnects and electronic components
Abstract
Flexible electronics are of a great interest for wearable and implantable medical devices due to their conformality with the body, compared to electronics made on rigid carriers. Packaging of such electronics needs to offer sufficient flexibility and in addition, has to provide good protection for the electronics inside, also in humid and harsh environments, to prevent device failure due to corrosion. Parylene C is a popular polymer due to its interesting diffusion barrier properties. Parylene C coatings are also extremely conformal, hence it offers the possibility to be used as flexibleprotecting encapsulation for electronic components andinterconnects. In order to provide sufficient mechanical support for the electronic circuit, a second encapsulation in PDMS will be performed. In our work, we study the barrier properties of Parylene for long time exposure to moisture and biofluids. Since adhesion is a very important parameter to prevent corrosion, this property is studied in detail. Various substrates and various adhesion promotion treatments are evaluated. Furthermore, copper interconnects coated with parylene C are immersed in biofluids at 37 C to study corrosion. Accelerated testing is also performed at 70 C to mimic long time exposure in a harsh, humid environment. Since the Parylene barrier layers are typically 5-15 micron thick, they are highly flexible, and hence they are interesting barriers to be used in flexible/stretchable electronics. Therefore, special attention is given to the evaluation of barrier properties when Parylene is bended and stretched.