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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Plovie, Bart
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Publications (5/5 displayed)
- 2021Fully integrated flexible dielectric monitoring sensor system for real-time in situ prediction of the degree of cure and glass transition temperature of an epoxy resincitations
- 2017Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymerscitations
- 2016One-time deformable thermoplastic devices based on flexible circuit board technologycitations
- 20152.5D smart objects using thermoplastic stretchable interconnectscitations
- 2015Free-form 2.5D thermoplastic circuits using one-time stretchable interconnections
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document
Free-form 2.5D thermoplastic circuits using one-time stretchable interconnections
Abstract
A technology is presented for the production of soft and rigid circuits with an arbitrary 2.5D fixed shape. The base of this technology is our proprietary technology for elastic circuits with a random shape, in which the elastic thermoset (mostly PDMS) polymer is now replaced by soft or rigid thermoplastic variants. An additional thermoforming step is required to transform the circuit from its initial flat to its final fixed 2.5D shape, but for rigid fixed shape circuits only one-time stretchability of the extensible interconnects is required, relieving the reliability requirements.