693.932 PEOPLE
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Casati, R. |
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| Kočí, Jan | Prague |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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Yang, Yang
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Topics
Publications (26/26 displayed)
- 2024Effect of growth temperature on the microstructure and properties of epitaxial MoS2 monolayers grown by metalorganic chemical vapor depositioncitations
- 2024Hybrid Bonding Bottlebrush Polymers Grafted from a Supramolecular Polymer Backbonecitations
- 2024Unraveling the Mechanism of Alkali Metal Fluoride Post‐Treatment of SnO<sub>2</sub> for Efficient Planar Perovskite Solar Cellscitations
- 2024Oxygen-Mediated (0D) Cs4PbX6 Formation during Open-Air Thermal Processing Improves Inorganic Perovskite Solar Cell Performancecitations
- 2024Width-Dependent Growth of Atomically Thin Quantum Nanoribbons
- 2023Micromechanics of intra-laminar hybrid lamina with hollow fibres:
- 2023Micromechanics of intra-laminar hybrid lamina with hollow fibres::a RVE model
- 2022Origin of {112} < 111 > antitwinning in a Ti-24Nb-4Zr-8Sn superelastic single crystalcitations
- 2021Fully integrated flexible dielectric monitoring sensor system for real-time in situ prediction of the degree of cure and glass transition temperature of an epoxy resincitations
- 20213D printing for polymer/particle-based processing: A reviewcitations
- 2019Ultra-long-term reliable encapsulation using an atomic layer deposited Hfo2/Al2o3/Hfo2 triple-interlayer for biomedical implantscitations
- 2018High-performance p-type multicrystalline silicon (mc-Si)citations
- 2018Pitch measurements validation of a structural coloured steel insert using Scanning Confocal Microscopy (SCM) and Atomic Force Microscopy (AFM)
- 20183D multifunctional composites based on large-area stretchable circuit with thermoforming technologycitations
- 2017Ultrafast magnetization reversal by picosecond electrical pulsescitations
- 2017Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymerscitations
- 2017Influence of Fullerene Acceptor on the Performance, Microstructure, and Photophysics of Low Bandgap Polymer Solar Cellscitations
- 2017Enhancing Mechanical Properties of Nanocomposites Using Interconnected Carbon Nanotubes (<i>i</i>CNT) as Reinforcementcitations
- 2016One-time deformable thermoplastic devices based on flexible circuit board technologycitations
- 2016RTM Production Monitoring of the A380 Hinge Arm Droop Nose Mechanism: A Multi-Sensor Approachcitations
- 2016Deformation twinning in the full-α″ martensitic Ti–25Ta–20Nb shape memory alloycitations
- 2015Deformable microsystem for in situ cure degree monitoring of GFRP(Glass Fibre Reinforced Plastic)
- 2015Laser-based surface preparation of composite laminates leads to improved electrodes for electrical measurementscitations
- 2015Free-form 2.5D thermoplastic circuits using one-time stretchable interconnections
- 2014Analysis of interlaminar fracture toughness and damage mechanisms in composite laminates reinforced with sprayed multi-walled carbon nanotubescitations
- 2013Continued development of all-back-contact silicon wafer solar cells at ANUcitations
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document
Free-form 2.5D thermoplastic circuits using one-time stretchable interconnections
Abstract
A technology is presented for the production of soft and rigid circuits with an arbitrary 2.5D fixed shape. The base of this technology is our proprietary technology for elastic circuits with a random shape, in which the elastic thermoset (mostly PDMS) polymer is now replaced by soft or rigid thermoplastic variants. An additional thermoforming step is required to transform the circuit from its initial flat to its final fixed 2.5D shape, but for rigid fixed shape circuits only one-time stretchability of the extensible interconnects is required, relieving the reliability requirements.