Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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Materials Map under construction

The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Andersen, Rasmus Grau

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Technical University of Denmark

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (5/5 displayed)

  • 2022Dynamic size effects across the scalescitations
  • 2020Cohesive traction–separation relations for tearing of ductile plates with randomly distributed void nucleation sites12citations
  • 2020Advancing Numerical Simulation Tools for Ductile Fracture in Thin Metal Platescitations
  • 2020Fundamental differences between plane strain bending and far-field plane strain tension in ductile plate failure21citations
  • 2019Micro-mechanics based cohesive zone modeling of full scale ductile plate tearing: From initiation to steady-state19citations

Places of action

Chart of shared publication
Nielsen, Kl
4 / 42 shared
Tekoğlu, C.
1 / 1 shared
Woelke, P. B.
1 / 1 shared
Londono, J. G.
1 / 1 shared
Felter, Christian Lotz
1 / 4 shared
Chart of publication period
2022
2020
2019

Co-Authors (by relevance)

  • Nielsen, Kl
  • Tekoğlu, C.
  • Woelke, P. B.
  • Londono, J. G.
  • Felter, Christian Lotz
OrganizationsLocationPeople

thesis

Advancing Numerical Simulation Tools for Ductile Fracture in Thin Metal Plates

  • Andersen, Rasmus Grau
Abstract

This thesis investigates the micro-mechanical material behavior leading to ductile fracture of thin metal plates. The main focus has been on how the micro-mechanical mechanisms that control ductile fracture can be linked to the phenomenological simulation tools. Tools that allow engineers, in a cost-efficient manner, to conduct accurate predictions of crack growth in large-scale plate structures subject to extreme loading conditions. The work demonstrates that tuning the key parameters defining the cohesive zone is required to represent accurately the failure predicted by micromechanics based Gurson simulations. For instance, when extensive crack growth takes place in a thin metal plate or when the damage-related microstructure (number, size, and distribution of voids) diverges from a homogeneous configuration. Throughout the thesis, mode I tearing is considered the primary loading condition, but the work also considers an additional shearing fracture mode. The effects from mixed mode loading conditions on the crack initiation and the interaction between microscopic voids are investigated as well as on the key parameters for the cohesive tractionseparation relations for a steadily growing crack. Finally, attention is drawn to the steady-state mode I tearing setup in comparison to the plane strain bending test, which are two typical loading scenarios encountered in the deformation of plate structures at the engineering scale. Despite both loading conditions experience the same nominal stress state, two significantlydifferent fracture strains have been reported experimentally. The micro-mechanical Gurson model constitutes an indepth analysis to search for the mechanisms leading to the fracture strain difference and reveals two significantly different localization phenomena. Additionally, a new parameter based on the through-thickness stress variation todistinguish the mode I tearing loading condition from plane strain bending test is defined.

Topics
  • impedance spectroscopy
  • microstructure
  • simulation
  • crack
  • bending flexural test
  • void