| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Schaubroeck, David
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (16/16 displayed)
- 2023Photo-crosslinkable biodegradable polymer coating to control fertilizer releasecitations
- 2021Investigating the nucleation of AlOx and HfOx ALD on polyimide : influence of plasma activationcitations
- 2020Development of an active high-density transverse intrafascicular micro-electrode probecitations
- 2020The use of ALD layers for hermetic encapsulation in the development of a flexible implantable micro electrode for neural recording and stimulation
- 2020The use of ALD layers for hermetic encapsulation in the development of a flexible implantable micro electrode for neural recording and stimulation
- 2019FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
- 2019FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
- 2019Ultra-long-term reliable encapsulation using an atomic layer deposited Hfo2/Al2o3/Hfo2 triple-interlayer for biomedical implantscitations
- 2019FITEP: a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
- 2017Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nervescitations
- 2017Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nervescitations
- 2017Accelerated hermeticity testing of biocompatible moisture barriers used for encapsulation of implantable medical devices
- 2013Ultrafast DPSS laser interaction with thin-film barrier stacks
- 2013Magnesium-enhanced enzymatically mineralized platelet-rich fibrin for bone regeneration applicationscitations
- 2011Surface modification of a photo definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper
- 2011Surface modification of a photo definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper
Places of action
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document
Ultrafast DPSS laser interaction with thin-film barrier stacks
Abstract
The fast growing market of organic electronics, including organic light emitting diodes (OLEDs), stimulates the development of versatile technologies for structuring thin-film materials. Ultrafast diode-pumped solid-state (DPSS) lasers have proven their full potential for patterning transparent conductors, but only few studies report on interaction with thin-film barrier layers. Indeed, in the case of flexible organic applications, thin-film barrier layers consisting of inorganic and sometimes inorganic/organic multi-layers are usually used for protection. This severely restricts the selection of suitable laser patterning conditions, as damaging the barrier stack will result in moisture and oxygen ingress, leading to accelerated device degradation. In this paper we present picosecond laser processes for selective patterning conductive polymers like poly(3,4-ethylene dioxythiophene):poly(styrene sulfonate) (PEDOT:PSS), without damaging the barrier, as well as for selective patterning the top encapsulation, without damaging the anode or cathode contacts. Careful examination using optical profilometry, SEM and chemical surface analysis reveals the importance of the laser wavelength (1064nm, 532nm, 355nm), pulse duration, pulse frequency, pulse energy, spot size, laser fluence, and pulse overlap. The fundamental laser material interaction is discussed for thin-film material stacks, and the material removal is believed to be driven by photomechanical and photochemical processes. After optimisation of the individual processes, the development of generic subtractive laser processes for industrial OLED manufacturing is discussed, with focus on process quality and speed.