Materials Map

Discover the materials research landscape. Find experts, partners, networks.

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The Materials Map is an open tool for improving networking and interdisciplinary exchange within materials research. It enables cross-database search for cooperation and network partners and discovering of the research landscape.

The dashboard provides detailed information about the selected scientist, e.g. publications. The dashboard can be filtered and shows the relationship to co-authors in different diagrams. In addition, a link is provided to find contact information.

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The Materials Map is still under development. In its current state, it is only based on one single data source and, thus, incomplete and contains duplicates. We are working on incorporating new open data sources like ORCID to improve the quality and the timeliness of our data. We will update Materials Map as soon as possible and kindly ask for your patience.

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Naji, M.
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Baets, Johan De

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Ghent University

in Cooperation with on an Cooperation-Score of 37%

Topics

Publications (5/5 displayed)

  • 2019FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayerscitations
  • 2019FITEP: a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayerscitations
  • 2017Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves21citations
  • 2011Surface modification of a photo definable epoxy resin with polydopamine to improve adhesion with electroless deposited coppercitations
  • 2002An O/E measurement probe based on an optics-extended MCM-D motherboard technologycitations

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Vandecasteele, Bjorn
3 / 10 shared
Maghari, Nima
3 / 6 shared
Verplancke, Rik
3 / 13 shared
Cuypers, Dieter
3 / 9 shared
Vanhaverbeke, Celine
2 / 5 shared
Ballini, Marco
3 / 6 shared
Fahmy, Ahmed
3 / 5 shared
Andrei, Alexandru
3 / 6 shared
Cauwe, Maarten
3 / 13 shared
Firrincieli, Andrea
3 / 5 shared
Patrick, Erin
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Braeken, Dries
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Ocallaghan, John
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Op De Beeck, Maaike
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Schaubroeck, David
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Kundu, Aritra
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Bashirullah, Rizwan
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Mader, Lothar
2 / 7 shared
Van Calster, André
2 / 3 shared
Van Vaeck, Luc
1 / 2 shared
Dubruel, Peter
1 / 31 shared
Van Den Eeckhout, Emilie
1 / 2 shared
Vanfleteren, Jan
1 / 24 shared
De Pauw, Herbert
1 / 1 shared
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2017
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Co-Authors (by relevance)

  • Vandecasteele, Bjorn
  • Maghari, Nima
  • Verplancke, Rik
  • Cuypers, Dieter
  • Vanhaverbeke, Celine
  • Ballini, Marco
  • Fahmy, Ahmed
  • Andrei, Alexandru
  • Cauwe, Maarten
  • Firrincieli, Andrea
  • Patrick, Erin
  • Braeken, Dries
  • Ocallaghan, John
  • Op De Beeck, Maaike
  • Schaubroeck, David
  • Kundu, Aritra
  • Bashirullah, Rizwan
  • Mader, Lothar
  • Van Calster, André
  • Van Vaeck, Luc
  • Dubruel, Peter
  • Van Den Eeckhout, Emilie
  • Vanfleteren, Jan
  • De Pauw, Herbert
OrganizationsLocationPeople

document

Surface modification of a photo definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper

  • Van Calster, André
  • Baets, Johan De
  • Van Vaeck, Luc
  • Schaubroeck, David
  • Dubruel, Peter
  • Van Den Eeckhout, Emilie
Abstract

The rapid evolution of microelectronics industry translates itself into a need for higher density substrates with smaller features. In order to fulfill these requirements, one has to minimize the roughness treatment for dielectric materials (to avoid high frequency losses due to skin effect in the conductor).1, 2 Since surface roughness is one of the key treatments for the improvement of adhesion, chemical surface modification can (over)compensate this loss of adhesion.3, 4In 2006, Messerschmitt et. al deposited a bio-inspired multifunctional polydopamine coating on a variety of substrates.5 Promising results were obtained concerning adhesion towards metals and biomacromolecules.Here, the surface of an epoxy resin is modified with a polydopamine layer to improve adhesion with electroless copper. A profound surface analysis of polydopamine modified epoxy resin surfaces is presented. Next, the influence of this modification strategy on the adhesion of electroless deposited copper is discussed. Finally, correlations between the adhesion strength and interface analysis are commented.

Topics
  • density
  • impedance spectroscopy
  • surface
  • strength
  • copper
  • resin