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Naji, M. |
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Motta, Antonella |
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Aletan, Dirar |
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Mohamed, Tarek |
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Ertürk, Emre |
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Taccardi, Nicola |
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Kononenko, Denys |
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Petrov, R. H. | Madrid |
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Alshaaer, Mazen | Brussels |
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Bih, L. |
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Casati, R. |
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Muller, Hermance |
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Kočí, Jan | Prague |
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Šuljagić, Marija |
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Kalteremidou, Kalliopi-Artemi | Brussels |
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Azam, Siraj |
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Ospanova, Alyiya |
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Blanpain, Bart |
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Ali, M. A. |
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Popa, V. |
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Rančić, M. |
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Ollier, Nadège |
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Azevedo, Nuno Monteiro |
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Landes, Michael |
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Rignanese, Gian-Marco |
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Baets, Johan De
Ghent University
in Cooperation with on an Cooperation-Score of 37%
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Publications (5/5 displayed)
- 2019FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
- 2019FITEP: a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
- 2017Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nervescitations
- 2011Surface modification of a photo definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper
- 2002An O/E measurement probe based on an optics-extended MCM-D motherboard technology
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document
Surface modification of a photo definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper
Abstract
The rapid evolution of microelectronics industry translates itself into a need for higher density substrates with smaller features. In order to fulfill these requirements, one has to minimize the roughness treatment for dielectric materials (to avoid high frequency losses due to skin effect in the conductor).1, 2 Since surface roughness is one of the key treatments for the improvement of adhesion, chemical surface modification can (over)compensate this loss of adhesion.3, 4In 2006, Messerschmitt et. al deposited a bio-inspired multifunctional polydopamine coating on a variety of substrates.5 Promising results were obtained concerning adhesion towards metals and biomacromolecules.Here, the surface of an epoxy resin is modified with a polydopamine layer to improve adhesion with electroless copper. A profound surface analysis of polydopamine modified epoxy resin surfaces is presented. Next, the influence of this modification strategy on the adhesion of electroless deposited copper is discussed. Finally, correlations between the adhesion strength and interface analysis are commented.