| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
| |
| Motta, Antonella |
| |
| Aletan, Dirar |
| |
| Mohamed, Tarek |
| |
| Ertürk, Emre |
| |
| Taccardi, Nicola |
| |
| Kononenko, Denys |
| |
| Petrov, R. H. | Madrid |
|
| Alshaaer, Mazen | Brussels |
|
| Bih, L. |
| |
| Casati, R. |
| |
| Muller, Hermance |
| |
| Kočí, Jan | Prague |
|
| Šuljagić, Marija |
| |
| Kalteremidou, Kalliopi-Artemi | Brussels |
|
| Azam, Siraj |
| |
| Ospanova, Alyiya |
| |
| Blanpain, Bart |
| |
| Ali, M. A. |
| |
| Popa, V. |
| |
| Rančić, M. |
| |
| Ollier, Nadège |
| |
| Azevedo, Nuno Monteiro |
| |
| Landes, Michael |
| |
| Rignanese, Gian-Marco |
|
Zhong, Xiangli
University of Manchester
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (23/23 displayed)
- 2024Understanding Ag liquid migration in SiC through ex-situ and in-situ Ag-Pd/SiC interaction studiescitations
- 2024High resolution analytical microscopy of damage progression within a polyester powder coating after cyclic corrosion testing
- 2023Precursor-Led Grain Boundary Engineering for Superior Thermoelectric Performance in Niobium Strontium Titanate.
- 2023High Power Factor Nb-Doped TiO2 Thermoelectric Thick Films: Toward Atomic Scale Defect Engineering of Crystallographic Shear Structurescitations
- 2023Mitigation effects of over-aging (T73) induced intergranular corrosion on stress corrosion cracking of AA7075 aluminum alloy and behaviors of η phase grain boundary precipitates during the intergranular corrosion formationcitations
- 2023Precursor-Led Grain Boundary Engineering for Superior Thermoelectric Performance in Niobium Strontium Titanatecitations
- 2023High Power Factor Nb-Doped TiO2 Thermoelectric Thick Films:Toward Atomic Scale Defect Engineering of Crystallographic Shear Structurescitations
- 2022Mechanism of FIB-Induced Phase Transformation in Austenitic Steelcitations
- 2021Oxidation and carburization behaviour of two type 316H stainless steel casts in simulated AGR gas environment at 550 and 600 °Ccitations
- 2020Comparing Xe+pFIB and Ga+FIB for TEM sample preparation of Al alloys: Minimising FIB-induced artefactscitations
- 2020Comparing Xe+pFIB and Ga+FIB for TEM sample preparation of Al alloys: Minimising FIB-induced artefactscitations
- 2018Multi-Modal Plasma Focused Ion Beam Serial Section Tomography of an Organic Paint Coatingcitations
- 2017A Single Source Precursor for Tungsten Dichalcogenide Thin Films: Mo1-xWxS2 (0 ≤ x ≤ 1) Alloys by Aerosol-Assisted Chemical Vapor Deposition (AACVD)citations
- 2016Chemical Vapour Deposition of Rhenium Disulfide and Rhenium-Doped Molybdenum Disulfide Thin Films Using Single-Source Precursorscitations
- 2016Xe+ Plasma FIB: 3D Microstructures from Nanometers to Hundreds of Micrometerscitations
- 2016Sample Preparation Methodologies for In Situ Liquid and Gaseous Cell Analytical Transmission Electron Microscopy of Electropolished Specimenscitations
- 2016Sample Preparation Methodologies for In Situ Liquid and Gaseous Cell Analytical Transmission Electron Microscopy of Electropolished Specimenscitations
- 2015Behavior of alloying elements during anodizing of Mg-Cu and Mg-W alloys in a fluoride/glycerol electrolytecitations
- 2014Formation of barrier-type anodic films on ZE41 magnesium alloy in a fluoride/glycerol electrolytecitations
- 2010Using microwave-assisted powder metallurgy route and nano-size reinforcements to develop high-strength solder compositescitations
- 2009Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy
- 2008Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites
- 2005Enhancing damping of pure magnesium using nano-size alumina particulatescitations
Places of action
| Organizations | Location | People |
|---|
document
Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy
Abstract
Sn-0.7Cu lead-free solder alloy reinforced with sub-micron size alumina particulates in different volume percentage was synthesized using powder metallurgy technique incorporated with microwave sintering. Following synthesis, the extruded materials were characterized in terms of physical and mechanical properties. The density values of the composite solder materials were found to decrease with an increase in volume percentage of alumina particulates. The results of room temperature tensile test revealed that yield stress and ultimate tensile stress of the composite solder materials improved with the addition of alumina particulates. Particular emphasis is placed to interrelate the effect of volume fraction of sub-micron size alumina particulate added in the Sn-0.7Cu alloy with the physical and tensile properties of the resultant composite solder materials.