| People | Locations | Statistics |
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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Birkett, Martin
Northumbria University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (23/23 displayed)
- 2024Precision depth-controlled isolated silver nanoparticle-doped diamond-like carbon coatings with enhanced ion release, biocompatibility, and mechanical performancecitations
- 2023Soft diamond-like carbon coatings with superior biocompatibility for medical applicationscitations
- 2023Biocompatible Ti3Au–Ag/Cu thin film coatings with enhanced mechanical and antimicrobial functionalitycitations
- 2023Biocompatible Ti3Au–Ag/Cu thin film coatings with enhanced mechanical and antimicrobial functionalitycitations
- 2022Enhanced mechanical and biocompatibility performance of Ti(1- x )Ag(x) coatings through intermetallic phase modificationcitations
- 2022Thermal activation of Ti(1-x)Au(x) thin films with enhanced hardness and biocompatibility citations
- 2022Tribological Behavior of Microalloyed Cu50Zr50 Alloy
- 2022Tribological Behavior of Microalloyed Cu50Zr50 Alloy
- 2022Mn3Ag(1-x)Cu(x)N antiperovskite thin films with ultra-low temperature coefficient of resistancecitations
- 2022Mn3Ag(1-x)Cu(x)N antiperovskite thin films with ultra-low temperature coefficient of resistancecitations
- 2022Investigating the Thermal and Mechanical Properties of Polyurethane Urea Nanocomposites for Subsea Applications
- 2022Thermal activation of Ti(1-x)Au(x) thin films with enhanced hardness and biocompatibilitycitations
- 2021Mechanical performance of biocompatible Ti-Au thin films grown on glass and Ti6Al4V substrates
- 2021Effect of noble metal (M=Ag, Au) doping concentration on mechanical and biomedical properties of Ti-M matrix thin films co-deposited by magnetron sputtering
- 2019A Numerical and Experimental Study of Adhesively-Bonded Polyethylene Pipelinescitations
- 2018Tuning the antimicrobial behaviour of Cu85Zr15 thin films in “wet” and “dry” conditions through structural modificationscitations
- 2016Mechanical behaviour of adhesively bonded polyethylene tapping teescitations
- 2016Electrical resistivity of CuAlMo thin films grown at room temperature by dc magnetron sputteringcitations
- 2016Resistor trimming geometry; past, present and futurecitations
- 2015Investigation into the Development of an Additive Manufacturing Technique for the Production of Fibre Composite Productscitations
- 2012Optimization of the deposition and annealing of CuAIMo thin film resistors
- 2008Discrete resistor technologies and potential future advancements
- 2006Effects of annealing on the electrical properties of NiCr vs AlCu thin film resistors prepared by DC magnetron sputtering
Places of action
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booksection
Effects of annealing on the electrical properties of NiCr vs AlCu thin film resistors prepared by DC magnetron sputtering
Abstract
NiCr is widely used in the manufacture of thin metal film resistors (TFR) in the value range 10Ω to 1MΩ because of its relatively large resistivity, low temperature co-efficient of resistance (TCR) and excellent stability of resistance. However the demand for TFR’s with ohmic values of less than 10Ω has significantly increased in recent years due to the rising demand for low-loss current sensing in many electronic products. Consequently this trend has highlighted a number of problems associated with the manufacture of lower resistance NiCr films, primarily increased film thickness and hence increase in deposition time.This paper investigates the electrical properties of AlCu as a replacement for NiCr in this lower resistance range. Films of NiCr and compositions of AlCu were prepared by DC magnetron sputtering in Ar. After deposition the films were annealed in both air and N2 atmospheres at a range of temperatures. A direct comparison of electrical characteristics of the two film systems was then performed. Results reveal that an increase in Al content produces a decrease in TCR and gives an improvement in resistance stability. A wide region of alloy composition exists where films with equivalent resistance stability and sheet resistance to NiCr can be obtained at lower deposition times.