| People | Locations | Statistics |
|---|---|---|
| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Birkett, Martin
Northumbria University
in Cooperation with on an Cooperation-Score of 37%
Topics
Publications (23/23 displayed)
- 2024Precision depth-controlled isolated silver nanoparticle-doped diamond-like carbon coatings with enhanced ion release, biocompatibility, and mechanical performancecitations
- 2023Soft diamond-like carbon coatings with superior biocompatibility for medical applicationscitations
- 2023Biocompatible Ti3Au–Ag/Cu thin film coatings with enhanced mechanical and antimicrobial functionalitycitations
- 2023Biocompatible Ti3Au–Ag/Cu thin film coatings with enhanced mechanical and antimicrobial functionalitycitations
- 2022Enhanced mechanical and biocompatibility performance of Ti(1- x )Ag(x) coatings through intermetallic phase modificationcitations
- 2022Thermal activation of Ti(1-x)Au(x) thin films with enhanced hardness and biocompatibility citations
- 2022Tribological Behavior of Microalloyed Cu50Zr50 Alloy
- 2022Tribological Behavior of Microalloyed Cu50Zr50 Alloy
- 2022Mn3Ag(1-x)Cu(x)N antiperovskite thin films with ultra-low temperature coefficient of resistancecitations
- 2022Mn3Ag(1-x)Cu(x)N antiperovskite thin films with ultra-low temperature coefficient of resistancecitations
- 2022Investigating the Thermal and Mechanical Properties of Polyurethane Urea Nanocomposites for Subsea Applications
- 2022Thermal activation of Ti(1-x)Au(x) thin films with enhanced hardness and biocompatibilitycitations
- 2021Mechanical performance of biocompatible Ti-Au thin films grown on glass and Ti6Al4V substrates
- 2021Effect of noble metal (M=Ag, Au) doping concentration on mechanical and biomedical properties of Ti-M matrix thin films co-deposited by magnetron sputtering
- 2019A Numerical and Experimental Study of Adhesively-Bonded Polyethylene Pipelinescitations
- 2018Tuning the antimicrobial behaviour of Cu85Zr15 thin films in “wet” and “dry” conditions through structural modificationscitations
- 2016Mechanical behaviour of adhesively bonded polyethylene tapping teescitations
- 2016Electrical resistivity of CuAlMo thin films grown at room temperature by dc magnetron sputteringcitations
- 2016Resistor trimming geometry; past, present and futurecitations
- 2015Investigation into the Development of an Additive Manufacturing Technique for the Production of Fibre Composite Productscitations
- 2012Optimization of the deposition and annealing of CuAIMo thin film resistors
- 2008Discrete resistor technologies and potential future advancements
- 2006Effects of annealing on the electrical properties of NiCr vs AlCu thin film resistors prepared by DC magnetron sputtering
Places of action
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booksection
Discrete resistor technologies and potential future advancements
Abstract
There have been a number of advancements in discrete resistor technologies over recent years and, although there have been numerous reports dealing with these developments individually, there is currently no literature available which provides an overall review of these improvements.This paper aims to present a summary of existing discrete resistor technologies such as wirewound, metal oxide, thick film and thin film. The key performance properties of each group are discussed and some recent improvements to manufacturing techniques and materials are presented, together with potential future developments.Some of the specific areas discussed include; tailoring of wirewound and metal oxide resistor designs and materials for pulse and fusing applications and modifications to thick film resistor patterns and trimming rules to increase power rating and pulse performance. A new low resistivity thin film alloy is then discussed together with methods of improving long term performance using passivation materials. Finally a brief review of alternative substrate materials to improve power handling is given.