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| Naji, M. |
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| Motta, Antonella |
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| Aletan, Dirar |
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| Mohamed, Tarek |
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| Ertürk, Emre |
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| Taccardi, Nicola |
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| Kononenko, Denys |
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| Petrov, R. H. | Madrid |
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| Alshaaer, Mazen | Brussels |
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| Bih, L. |
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| Casati, R. |
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| Muller, Hermance |
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| Kočí, Jan | Prague |
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| Šuljagić, Marija |
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| Kalteremidou, Kalliopi-Artemi | Brussels |
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| Azam, Siraj |
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| Ospanova, Alyiya |
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| Blanpain, Bart |
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| Ali, M. A. |
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| Popa, V. |
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| Rančić, M. |
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| Ollier, Nadège |
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| Azevedo, Nuno Monteiro |
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| Landes, Michael |
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| Rignanese, Gian-Marco |
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Vásquez Quintero, Andrés
in Cooperation with on an Cooperation-Score of 37%
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Publications (5/5 displayed)
- 2017Thin and spherical-cap-shaped LCD with a flexible thin-film driver for use in a smart contact lens
- 2017Stretchable electronic platform for soft and smart contact lens applicationscitations
- 2016Stretchable electronic platform for soft and smart contact lens applications
- 2014Development of a new generation of ammonia sensors on printed polymeric hotplatescitations
- 2014Printing and encapsulation of electrical conductors on polylactic acid (PLA) for sensing applications
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document
Printing and encapsulation of electrical conductors on polylactic acid (PLA) for sensing applications
Abstract
This paper presents the printing of resistive and interdigitated (IDE) capacitive devices for temperature and humidity sensing applications, respectively, on biodegradable polylactic acid (PLA) substrates. Inkjet and gravure printing were evaluated to transfer silver-based nanoparticles inks. Flash photonic ink sintering methodologies were employed to maintain the PLA mechanical integrity due to its low glass transition temperature (58 degrees C). Between the two printing techniques investigated, gravure-printed devices on 200 mu m-thick PLA sheets were shown to have better resolution and higher sensitivities to temperature and humidity (1100 ppmK(-1) and 5.6 fF/%RH). Additionally, we demonstrated the inkjet printing of IDE onto thin (25 mu m) dissolved-PLA spin-coated substrates, to enhance the mechanical flexibility and to reduce the response time to humidity (from 238 s to 70 s). Finally, a low temperature encapsulation is proposed by embedding the printed structures within PLA sheets.