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Tsukamoto, H.
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Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces
Abstract
The formation of intermetallic compounds (IMCs) at solder/substrate interfaces is essential, which have a critical effect on the mechanical reliability of solder joints. In this study, nanoindentation was used to investigate elastic modulus, hardness and creep properties of the IMCs formed at the interface between Sn-Cu (-Ni) solder ball grid arrays (BGAs) and Cu substrates in multiple-reflowed samples. All the tests were conducted at room temperature. The elastic modulus and hardness of (Cu,Ni)Sn were higher than those of CuSn. The hardnesses of (Cu,Ni)Sn were scattered, which may be attributed to the crystallographic characteristics such as a growth texture of the IMCs. The creep stress exponents of the IMCs were extremely high (9.5∼44), compared to pure tin and solder alloys.